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Chapter One: Semiconductors BasicsElectricity Electric Charge Electric Current Electromagnetic Force (EMF) and Voltage Power Joule's LawConductivity Conductors Insulators SemiconductorsSilicon - The Crucial SemiconductorSemiconductor History - Part OneSemiconductor Value Chain Customer Need & Market Demand Chip Design Fabrication & Manufacturing Packaging & Assembly System Integration Product DeliveryPerformance, Power, Area, and Cost (PPAC)Who Uses Semiconductors? Chapter Two: Circuit Building BlocksDiscrete Components - The Building Blocks of CircuitsTransistors Transistor Structure How Transistors Work - A Water Analogy FinFET vs. MOSFET TransistorsCMOSGeometric vs. Functional Scaling - Part 1Logic Gates Chapter Three: Building a System Different Levels of Electronics - How the System Fits TogetherIntegrated Circuit Design Flow System Level Architecture Front End Design Design Verification Physical Design High Level Synthesis Design Netlist Floorplanning Place-and-Route Clock-tree Synthesis Back End Validation Manufacturing (GDS)EDA Tools Chapter Four: Semiconductor Manufacturing Front-End ManufacturingDepositionPatterning & Lithography Removal ProcessesPhysical Property AlterationCycling - Pre & Post Metal Wafer Probing, Yield, and Failure AnalysisBack-End Manufacturing Assembly & TestWafer DicingDie BondingExternal Interconnect FormationEncapsulation and SealingFinal Testing Chapter Five: Tying the System Together Input / Output (I/O) IC Packaging Wire Bonding Flip Chip Packaging Wafer Level Packaging Multi-Chip Modules & System-In Packages 2.5/3D Packaging Signal Integrity Bus Interfaces Power Flow within Electronic Systems Chapter Six: Common Circuits and System Components Digital vs. Analog Wavelength vs. Frequency Building a System - Putting Components Together Common System Components - The SIA Framework Micro Components Logic Memory OSD Analog Components Micro Components Microprocessors & Microcontrollers Digital Signal Processors Micro Component Market Summary Logic Special Purpose Logic Central Processing Unit Graphics Processing Unit ASIC vs. FPGA System on Chip Logic Market Summary Memory Memory Stack Volatile Memory Random Access MemoryDRAM SRAM Non-Volatile Memory Primary Memory ROMPROMEPROMEEPROMNAND Secondary Memory HDD SSD Stacked Die Memory High Bandwidth Memory Hybrid Memory Cube Memory Market Summary Optoelectronics, Sensors & Actuators, and Discrete Components Optoelectronics Sensors & Actuators MEMS Discrete Components PMIC PMU OSD Market Summary Analog Components General Purpose Analog IC vs. ASSP Analog Component Market Summary Chapter Seven: RF & Wireless Technologies RF Signals and The Electromagnetic Spectrum RFIC - Transmitters and Receivers Power Source Oscillators Modulators & Demodulators Amplifiers Antenna Filters OSI Reference Model Application Layer Physical Layer (PHY) Macro System Stack RF and Wireless - The Big Picture Base Stations Tracking a Phone Call Broadcasting and Frequency Regulation Digital Signal ProcessingTDMA & CDMA 1G to 5G - An Evolution Wireless Communication and Cloud Computing Chapter Eight: System Architecture and Integration Macro vs. Micro-Architecture Common Chip Architectures Von Neumann Architecture Harvard Architecture CISC vs. RISC Choosing an ISA Heterogenous vs. Monolithic Integration Chapter Nine: The Semiconductor Industry - Past, Present, and Future Semiconductor Industry - Major Challenges Design Costs Manufacturing Costs Evolution of the Semiconductor Industry 1960-1980's: Fully Integrated Semiconductor Companies 1980's-2000: IDM + Fabless Design + Pure-Play Foundry 2000-Today: IDM + Fabless Design + Foundries + System Companies Fabs vs. Fabless Design - The Case Against IDM's Industry Outlook Cyclical Revenues and High Volatility High R&D and Capital Investment Positive Productivity GrowthLong-Term Profitability High Consolidation 2010-2021: Major Acquisitions by Year U.S. vs. International Semiconductor Market COVID-19 & The Semiconductor Supply Chain Chinese Competition Chapter Ten: The Future of Semiconductors and Electronic Systems Prolonging Moore's Law - Sustaining Technologies 2.5 & 3D Die Stacking Gate-All-Around (GAA) Transistors & New Channel Materials Custom Silicon & Specialized Accelerators Graphene Carbon Nanotubes & 2D Transistors Overcoming Moore's Law - New Technologies Quantum Computing & Quantum Transistors Neuromorphic Computing