Mems & Microsystems: Design, Manufacture, and Nanoscale Engineering (Hardcover/ 2nd Ed.)
2013년 9월 9일 이후 누적수치입니다.
MEMS & Microsystems provides an engineering design approach to MEMS and microsystems, appropriate for professionals and senior level students. Numerous examples, cases, and applied problems are provided. It includes numerous examples, cases, and applied problems and covers both sides of the technology by carefully explaining the electrical/electronic aspects while providing strong coverage of the mechanical side of MEMS, dual coverage that no other textbook provides. This new edition presents new and expanded coverage of microfabrication and assembly & packaging technologies and a new chapter covering nanotechnology nanoscale engineering.
Chapter 1: Overview of MEMS and Microsystems.
1.1 MEMS and Microsystem.
1.2 Typical MEMS and Microsystems Products.
1.3 Evolution of Microfabrication.
1.4 Microsystems and Microelectronics.
1.5 The Multidisciplinary Nature of Microsystems Design and Manufacture.
1.6 Microsystems and Miniaturization.
1.7 Application of Microsystems in Automotive Industry.
1.8 Application of Microsystems in Other Industries.
1.9 Markets for Microsystems.
Chapter 2: Working Principles of Microsystems.
2.4 MEMS with Microactuators.
Chapter 3: Engineering Science for Microsystems Design and Fabrication.
3.2 Atomic Structure of Matters.
3.3 Ions and Ionization.
3.4 Molecular Theory of Matter and Inter-molecular Forces.
3.5 Doping of Semiconductors.
3.6 The Diffusion Process.
3.7 Plasma Physics.
Chapter 4: Engineering Mechanics for Microsystems Design.
4.2 Static Bending of Thin Plates.
4.3 Mechanical Vibration.
4.5 Fracture Mechanics.
4.6 Thin Film Mechanics.
4.7 Overview on Finite Element Stress Analysis.
Chapter 5: Thermofluid Engineering and Microsystems Design.
5.2 Overview on the Basics of Fluid Mechanics in Macro and Mesoscales.
5.3 Basic Equations in Continuum Fluid Dynamics.
5.4 Laminar Fluid Flow in Circular Conduits.
5.5 Computational Fluid Dynamics.
5.6 Incompressible Fluid Flow in Microconduits.
5.7 Overview on Heat Conduction in Solids.
5.8 Heat Conduction in Multi-layered Thin Films.
5.9 Heat Conduction in Solids in Submicrometer Scale.
Chapter 6: Scaling Laws in Miniaturization.
6.1 Introduction to Scaling.
6.2 Scaling in Geometry.
6.3 Scaling in Rigid-Body Dynamics.
6.4 Scaling in Electrostatic Forces.
6.5 Scaling of Electromagnetic Forces.
6.6 Scaling in Electricity.
6.7 Scaling in Fluid Mechanics.
6.8 Scaling in Heat Transfer.
Chapter 7: Materials for MEMS and Microsystems.
7.2 Substrates and Wafers.
7.3 Active Substrate Materials.
7.4 Silicon as a Substrate Material.
7.5 Silicon Compounds.
7.6 Silicon Piezoresistors.
7.7 Gallium Arsenide.
7.9 Piezoelectric Crystals.
7.11 Packaging Materials.
Chapter 8: Microsystems Fabrication Processes.
8.3 Ion Implantation.
8.6 Chemical Vapor Deposition.
8.7 Physical Vapor Deposition - Sputtering.
8.8 Deposition by Epitaxy.
8.10 Summary of Microfabrication.
Chapter 9: Overview of Micromanufacturing.
9.2 Bulk Micromanufacturing.
9.3 Surface Micromachining.
9.4 The LIGA Process.
9.5 Summary on Micromanufacturing.
Chapter 10: Microsystem Design.
10.2 Design Considerations.
10.3 Process Design.
10.4 Mechanical Design.
10.5 Mechanical Design Using Finite Element Method.
10.6 Design of Silicon Die of a Micropressure Sensor.
10.7 Design of Microfluidics Network Systems.
10.8 Computer-Aided Design.
Chapter 11: Assembly, Packaging and Testing of Microsystems.
11.2 Overview of Microassembly.
11.3 The High Costs of Microassembly.
11.4 Microassembly Processes.
11.5 Major Technical Problems in Microassembly.
11.6 Microassembly Work Cells.
11.7 Challenging Issues in Microassembly.
11.8 Overview of Microsystems Packaging.
11.9 General Considerations in Packaging Design.
11.10 The Three Levels of Microsystems Packaging.
11.11 Interfaces in Microsystems Packaging.
11.12 Essential Packaging Technologies.
11.13 Die preparation.
11.14 Surface Bonding.
11.15 Wire bonding:.
11.16 Sealing and Encapsulation.
11.17 Three-dimensional Packaging.
11.18 Selection of Packaging Materials.
11.19 Signal Mapping and Transduction.
11.20 Design Case on Pressure Sensor Packaging.
11.21 Reliability in MEMS Packaging.
11.22 Testing for Reliability.
Chapter 12: Introduction to Nanoscale Engineering.
12.2 Micro and Nanoscale Technologies.
12.3 General Principle in Nanofabrication.
12.5 Applications of Nanoproducts.
12.6 Quantum Physics.
12.7 Molecular Dynamics.
12.8 Fluid Flow in Submicrometer and Nano Scales.
12.9 Heat Conduction in Nanoscale.
12.10 Measurement of Thermal Conductivity.
12.11 Challenges in Nanoscale Engineering.
12.12 Social Impacts of Nanoscale Engineering.
Robert Kahn was born on October 24, 1916 in the Bronx and at age 18 legally changed his name to Kane. In 1936, this self-proclaimed “compulsive doodleholic” pencilled and inked his first comic book work, Hiram Hick. By 1938 he was selling humorous filler stories to DC Comics, including Professor Doolittle and Ginger Snap.
Kane met writer Bill Finger at a party in 1938, and they soon were collaborating on comic book submissions. Their most famous effort, Batman, first appeared in DETECTIVE COMICS #27 (May 1939). As Batman’s po pularity demanded additional output, Kane kept up the pace by adding assistants and dropping non-Batman assignments. He discontinued his comic book efforts in mid-1943 to pencil the daily Batman and Robin newspaper strip. After the strip’s 1946 demise, Kane returned to illustrating Batman’s comic book adventures and, with the help of several ghosts, remained involved with comics until his retirement in 1968.
The success of the Batman television series brought Kane and his art back into the public eye in 1966. He was subsequently featured in various one-man art shows at galleries and museums nationwide and released a number of limited-edition lithographs. He served as a consultant on the 1989 Batman feature film and its sequels. His autobiography, Batman and Me, was published in 1989, and in 1996 he was inducted into the Eisner Awards Hall of Fame. Kane died on November 3, 1998.
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