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종합적인 반도체 제조업체에서는 이미 패키지와 테스트에 관련된 실무 전문성 있는 책자를 2020년에 발간한 바 있으며 본 책자는 그 후속편이라 할 수 있겠습니다.

이 책자가 반도체업에 종사하는 모든 분들께 도움이 될 것으로 생각하며 특히 메모리 반도체인 DRAM과 NAND의 기본적인 이해 및 FabFabrication,

반도체 공장의 제조공정과 각종 장비에 대한 궁금증 또는 필요성이 있는 직접 관련 업무의 종사자분들, 반도체 산업의 기반이라 할 수있는 재료, 부품, 장비업에 종사하시는 분들,

그리고 교육 현장에서 학생들을 가르치시는 선생님들과 미래의 반도체 세계최고 전문가를 꿈꾸는 대한민국의 많은 희망들께 도움이 될 것으로 기대합니다.

다만 한 가지 아쉬운 점은 산업 보안 등의 이유로 저자들이 담고자 했던 내용들을 온전히 담지 못한것이며, 이에 대해서는 독자 여러분들의 넓은 이해를 구하고자 합니다.

종합적인 반도체 제조업체에서는 이미 패키지와 테스트에 관련된 실무 전문성 있는 책자를 2020년에 발간한 바 있으며 본 책자는 그 후속편이라 할 수 있겠습니다.

이 책자가 반도체업에 종사하는 모든 분들께 도움이 될 것으로 생각하며 특히 메모리 반도체인 DRAM과 NAND의 기본적인 이해 및 FabFabrication,

반도체 공장의 제조공정과 각종 장비에 대한 궁금증 또는 필요성이 있는 직접 관련 업무의 종사자분들, 반도체 산업의 기반이라 할 수있는 재료, 부품, 장비업에 종사하시는 분들,

그리고 교육 현장에서 학생들을 가르치시는 선생님들과 미래의 반도체 세계최고 전문가를 꿈꾸는 대한민국의 많은 희망들께 도움이 될 것으로 기대합니다.

다만 한 가지 아쉬운 점은 산업 보안 등의 이유로 저자들이 담고자 했던 내용들을 온전히 담지 못한것이며, 이에 대해서는 독자 여러분들의 넓은 이해를 구하고자 합니다.

01 반도체 개요

● 반도체 제조기술 개요···················································5

01. 반도체 정의····································································· 7

● 반도체란?···································································7

● 반도체의 종류 ····························································8

02. 반도체 역사···································································· 9

● 트랜지스터 ·································································9

● 메모리 ···································································· 12

● 세계 메모리 반도체 선도하는 대한민국·························· 15

03. 미래 메모리 반도체························································ 17

● 메모리 시장······························································ 17

● 기술적인 한계··························································· 18

● PCRAM 제품·····························································20

● ReRAM 제품 ····························································25

● STT-MRAM 제품·······················································27

● 요약········································································31

02 DRAM Memory 제품

01. DRAM Memory 소개·····················································37

● DRAM이란? ·····························································37

● DRAM 운용 제품별 특징·············································39

02. DRAM 기본 동작 소개···················································· 41

● MOSFET·································································· 41

● DRAM Architecture ··················································45

● 주요 동작 소개··························································48

● SWD, S/A 동작 이해···················································52

● REFRESH ·······························································55

03. DR

01 반도체 개요
● 반도체 제조기술 개요···················································5
01. 반도체 정의····································································· 7
● 반도체란?···································································7
● 반도체의 종류 ····························································8
02. 반도체 역사···································································· 9
● 트랜지스터 ·································································9
● 메모리 ···································································· 12
● 세계 메모리 반도체 선도하는 대한민국·························· 15
03. 미래 메모리 반도체························································ 17
● 메모리 시장······························································ 17
● 기술적인 한계··························································· 18
● PCRAM 제품·····························································20
● ReRAM 제품 ····························································25
● STT-MRAM 제품·······················································27
● 요약········································································31

02 DRAM Memory 제품
01. DRAM Memory 소개·····················································37
● DRAM이란? ·····························································37
● DRAM 운용 제품별 특징·············································39
02. DRAM 기본 동작 소개···················································· 41
● MOSFET·································································· 41
● DRAM Architecture ··················································45
● 주요 동작 소개··························································48
● SWD, S/A 동작 이해···················································52
● REFRESH ·······························································55
03. DRAM 주요 Process Module·········································57
● ISO / GATE··························································AM 주요 Process Module·········································57

● ISO / GATE·······························································57

● SAC·········································································59

● SN·········································································· 61

● MLM·······································································62

04. DRAM 변화 방향···························································64

● DRAM Memory 기술 변화 요구···································64

03 NAND Memory 제품

01. NAND FLASH Memory 소개··········································73

● FLASH Memory란?···················································73

● FLASH Memory Market Trend···································· 76

02. NAND FLASH 기본 동작 소개·········································79

● NAND Architecture···················································79

● Erase/Read/Write Operation······································83

● Cell의 형태 및 String 구조···········································93

● ISPP········································································97

● Cell 분포 및 Multi bit cell ···········································99

03. 3D NAND 구조 소개···················································· 103

● 2D NAND와 3D NAND············································103

● PUC 구조·······························································106

● CTF·······································································107

● Pipe와 Pipeless ······················································ 110

● 3D NAND Process Sequence····································111

04. 3D NAND Key Process··············································· 115

● PLUG···································································· 115

● ONOP··································································· 119

● SLIM····································································· 121

05. Future NAND FLASH Memory···································· 123

● 3D Re-NAND·························································123

● 3D Fe-NAND·························································124

● SGVC····································································124

04 Diffusion_Furnace 공정

01. Diffusion 소개···························································· 131

● Diffusion 정의·························································132

● Diffusion 대표 공정 및 소재 소개································133

● Diffusion 대표 장비 소개···········································137

02. Furnace공정 이해······················································· 142

● Diffusion공정 소개··················································142

● Oxidation공정 소개·················································142

● LPCVD·································································· 149

● ALD공정································································160

03. Furnace 장비의 이해 ··················································· 170

● Furnace 장비 소개··················································· 170

● Batch 장비····························································· 171

● Chamber 장비 소개················································· 179

04. 공정과 장비 관리 소개·················································· 186

● 전산 시스템 활용 관리··············································186

● PM········································································186

05. 미래 기술 해결 과제······················································188

05 Diffusion (Ion Implant)

01. Ion Implantation공정 개요··········································· 195

● Ion Implantation공정의 역사와 정의··························· 195

● Ion Implantation 관련 주요 공정································197

● Ion Implantation공정의 주요 장비······························198

● Ion Implantation 장
·····57
● SAC·········································································59
● SN·········································································· 61
● MLM·······································································62
04. DRAM 변화 방향···························································64
● DRAM Memory 기술 변화 요구···································64

03 NAND Memory 제품
01. NAND FLASH Memory 소개··········································73
● FLASH Memory란?···················································73
● FLASH Memory Market Trend···································· 76
02. NAND FLASH 기본 동작 소개·········································79
● NAND Architecture···················································79
● Erase/Read/Write Operation······································83
● Cell의 형태 및 String 구조···········································93
● ISPP········································································97
● Cell 분포 및 Multi bit cell ···········································99
03. 3D NAND 구조 소개···················································· 103
● 2D NAND와 3D NAND············································103
● PUC 구조·······························································106
● CTF·······································································107
● Pipe와 Pipeless ······················································ 110
● 3D NAND Process Sequence····································111
04. 3D NAND Key Process··············································· 115
● PLUG···································································· 115
● ONOP··································································· 119
● SLIM····································································· 121
05. Future NAND FLASH Memory···································· 123
● 3D Re-NAND··················································
·······123
● 3D Fe-NAND·························································124
● SGVC····································································124

04 Diffusion_Furnace 공정
01. Diffusion 소개···························································· 131
● Diffusion 정의·························································132
● Diffusion 대표 공정 및 소재 소개································133
● Diffusion 대표 장비 소개···········································137
02. Furnace공정 이해······················································· 142
● Diffusion공정 소개··················································142
● Oxidation공정 소개·················································142
● LPCVD·································································· 149
● ALD공정································································160
03. Furnace 장비의 이해 ··················································· 170
● Furnace 장비 소개··················································· 170
● Batch 장비····························································· 171
● Chamber 장비 소개················································· 179
04. 공정과 장비 관리 소개·················································· 186
● 전산 시스템 활용 관리··············································186
● PM········································································186
05. 미래 기술 해결 과제······················································188

05 Diffusion (Ion Implant)
01. Ion Implantation공정 개요··········································· 195
● Ion Implantation공정의 역사와 정의··························· 195
● Ion Implantation 관련 주요 공정································197
● Ion Implantation공정의 주요 장비······························198
● Ion Implantation 장비의 주요 구성·····························200
02. DRAM/NAND Ion Implantation Application·················200
● Well Formation·······················································201
● Threshold Adju비의 주요 구성·····························200

02. DRAM/NAND Ion Implantation Application·················200

● Well Formation·······················································201

● Threshold Adjust Implant·········································202

● Source/Drain Implant··············································202

● Lightly Doped Drain················································203

03. Ion Implantation 구성과 Hardware······························205

● Gas 구성································································205

● HW 기본 구성·························································208

04. Ion Implantation Physics············································ 217

● Scattering 현상······················································· 218

● Stopping Mechanism··············································· 218

● Ion Projection Range···············································221

● Channeling Effect···················································222

● Shadowing Effect···················································224

● Damage Engineering···············································225

● Annealing······························································227

● RTA 도입 및 특징·····················································228

● 이온주입 후의 Monitoring 방법··································230

05. Ion Implantation 관련 미래 기술···································232

● Cold & Hot Implantation··········································232

● Plasma Doping·······················································233

● Co Implantation······················································235

● Advanced Anneal···················································237

06 Thinfilm_ CVD 공정

01. CVD공정 소개 ····························································245

● CVD공정 정의·························································246

02. CVD공정의 역할 및 이해···············································248

● 절연막 역할····························································248

● Gap fill 특성····························································251

● HARD MASK 역할···················································252

● Low-k 절연막·························································253

03. CVD 제조 Fab 장비의 이해············································254

● 장비 관리 특성························································255

● 주요 부품 특성의 이해··············································257

04. CVD 주요 공정 장비의 소개···········································263

● PE CVD USG공정····················································263

● Thermal CVD BPSG공정··········································264

● PE CVD ARC공정····················································266

● HDP공정································································268

● SOD공정································································271

● PE Nitride공정························································273

● ACL Hard Mask공정·················································273

● Low-k공정·····························································275

● NDC공정································································276

● Gate ON Stack공정·················································277

05. CVD 장비 향후 Trends·················································278

07 Thinfilm_ PVD 공정

01. PVD공정····································································285

● PVD공정 소개·························································285

02. PVD공정의 요구사항····················································286

03. Metal 물질의 특성·······················································286

● Aluminum 물질·······················································287

● Titanium 물질·························································287

● Tungsten 물질·················
st Implant·········································202
● Source/Drain Implant··············································202
● Lightly Doped Drain················································203
03. Ion Implantation 구성과 Hardware······························205
● Gas 구성································································205
● HW 기본 구성·························································208
04. Ion Implantation Physics············································ 217
● Scattering 현상······················································· 218
● Stopping Mechanism··············································· 218
● Ion Projection Range···············································221
● Channeling Effect···················································222
● Shadowing Effect···················································224
● Damage Engineering···············································225
● Annealing······························································227
● RTA 도입 및 특징·····················································228
● 이온주입 후의 Monitoring 방법··································230
05. Ion Implantation 관련 미래 기술···································232
● Cold & Hot Implantation··········································232
● Plasma Doping·······················································233
● Co Implantation······················································235
● Advanced Anneal···················································237

06 Thinfilm_ CVD 공정
01. CVD공정 소개 ····························································245
● CVD공정 정의·························································246
02. CVD공정의 역할 및 이해···············································248
● 절연막 역할····························································248
● Gap fill 특성····························································251
● HARD MASK 역할·······························································288

● Cobalt 물질····························································289

● Tantalum 물질························································289

● Copper 물질···························································290

04. PVD 주요 특성의 이해··················································290

● Sheet Resistance····················································290

● Contact Silicide 특성················································291

● EM 현상·································································292

● ALD 방식·······························································293

● Damascene 구조·····················································293

05. PVD공정의 Fab 장비의 이해········································· 294

● Sputter공정 장비·····················································296

● Contact Silicide·······················································300

● ALD TiN 장비·························································302

● CVD W 장비···························································304

● LFW 장비·······························································307

● EP Cu 장비·····························································309

● Cu Barrier Metal 장비·············································· 312

06. PVD공정 향후 Trends·················································· 314

08 Photo 공정

01. Photo공정의 역할························································321

● Photo공정 소개·······················································321

● Photo Process의 이해··············································322

● Photo 장비의 종류···················································324

● Photo에 사용되는 소재·············································328

02. Photo공정·································································330

● Imaging·······························
···························252
● Low-k 절연막·························································253
03. CVD 제조 Fab 장비의 이해············································254
● 장비 관리 특성························································255
● 주요 부품 특성의 이해··············································257
04. CVD 주요 공정 장비의 소개···········································263
● PE CVD USG공정····················································263
● Thermal CVD BPSG공정··········································264
● PE CVD ARC공정····················································266
● HDP공정································································268
● SOD공정································································271
● PE Nitride공정························································273
● ACL Hard Mask공정·················································273
● Low-k공정·····························································275
● NDC공정································································276
● Gate ON Stack공정·················································277
05. CVD 장비 향후 Trends·················································278

07 Thinfilm_ PVD 공정
01. PVD공정····································································285
● PVD공정 소개·························································285
02. PVD공정의 요구사항····················································286
03. Metal 물질의 특성·······················································286
● Aluminum 물질·······················································287
● Titanium 물질·························································287
● Tungsten 물질························································288
● Cobalt 물질····························································289
● Tantalum 물질························································289
● Copper 물질···························································2··································330

● Focus····································································336

● Dose·····································································338

● Leveling·································································339

● Overlay··································································339

● Alignment······························································ 341

● Overlay··································································345

● Overlay Control······················································348

● MASK····································································353

● Photo Resist···························································357

03. Photo 장비·································································363

● Track·····································································363

● Scanner·································································370

04. Photo공정 관리··························································377

● Overlay··································································377

● Incell·····································································379

● CD········································································379

● Defect···································································381

05. Photo 미래 기술··························································382

● 차세대 Photo Graphy 기술········································382

● EUV란···································································386

● 기존 ArF와의 차이점················································387

● EUV 기술의 문제점··················································388

09 Etch 공정

01. Etch 소개·······························································
90
04. PVD 주요 특성의 이해··················································290
● Sheet Resistance····················································290
● Contact Silicide 특성················································291
● EM 현상·································································292
● ALD 방식·······························································293
● Damascene 구조·····················································293
05. PVD공정의 Fab 장비의 이해········································· 294
● Sputter공정 장비·····················································296
● Contact Silicide·······················································300
● ALD TiN 장비·························································302
● CVD W 장비···························································304
● LFW 장비·······························································307
● EP Cu 장비·····························································309
● Cu Barrier Metal 장비·············································· 312
06. PVD공정 향후 Trends·················································· 314

08 Photo 공정
01. Photo공정의 역할························································321
● Photo공정 소개·······················································321
● Photo Process의 이해··············································322
● Photo 장비의 종류···················································324
● Photo에 사용되는 소재·············································328
02. Photo공정·································································330
● Imaging·································································330
● Focus····································································336
● Dose·····································································338
● Leveling·································································339
● Overlay····························································397

● 실생활에서 본 Etch Engineering 개요 ························397

02. Etch 기본···································································402

● FAB공정과 반도체 소자············································402

● Etch의 원리와 메커니즘············································408

● 플라즈마 정의와 성질··············································· 413

● Etch 고려사항························································· 419

● Etch공정관리를 위한 결과물······································431

● 식각 가스와 식각 물질 ·············································440

03. Etch 적용과 응용·························································444

● Etch 대표 구조공정··················································444

● Etch 장비 구성과 종류··············································454

● Plasma Source에 따른 Etch 장비 구분························465

04. ETCH 실전, 양산 FAB에서 ETCH 엔지니어 업무··············· 476

● 팹에서의 양산 기술·················································· 476

● Etch 장비의 유지 관리··············································482

● 양산에서 Etch가 가지는 어려움··································487

● Etch 양산 엔지니어의 하루········································489

05. Etch Issue 및 향후 개발 방향········································ 490

● 반도체 미세화 트렌트와 식각 이슈······························490

● 기술적 한계 극복 방안과 기술 발전 방향······················492

10 Cleaning 공정

01. Cleaning공정······························································507

● Cleaning공정 소개···················································507

02. Cleaning Chemical의 종류와 특징 ································ 511

● SPM 세정······························································· 511

● APM 세정······························································· 514

● DHF / BOE 세정······················································ 517

● H3PO4, Phosphoric Acid 세정····································520

● Ozone 세정 ·······································
··········339
● Alignment······························································ 341
● Overlay··································································345
● Overlay Control······················································348
● MASK····································································353
● Photo Resist···························································357
03. Photo 장비·································································363
● Track·····································································363
● Scanner·································································370
04. Photo공정 관리··························································377
● Overlay··································································377
● Incell·····································································379
● CD········································································379
● Defect···································································381
05. Photo 미래 기술··························································382
● 차세대 Photo Graphy 기술········································382
● EUV란···································································386
● 기존 ArF와의 차이점················································387
● EUV 기술의 문제점··················································388

09 Etch 공정
01. Etch 소개···································································397
● 실생활에서 본 Etch Engineering 개요 ························397
02. Etch 기본···································································402
● FAB공정과 반도체 소자············································402
● Etch의 원리와 메커니즘············································408
● 플라즈마 정의와 성질··············································· 413
● Etch 고려사항························································· 419
● Etch공정관리를 위한 결과물······································521

● NFAM 세정····························································525

● Function Water 세정················································527

● HF/NH3 Gas 건식 세정·············································531

03. Cleaning 장비의 종류와 특징 ········································534

● Batch Type····························································534

● Wet Single Type·····················································537

● Dry Single Type······················································539

● Scrubber 세정························································542

04. Cleaning공정의 품질 관리와 생산장비 관리····················544

● defect ··································································544

● Uniformity ····························································546

● Contamination ·······················································548

● Fume····································································548

● Cross contamination···············································550

● Selectivity······························································552

● Leaning·································································553

● Flow Rate······························································555

● Temperature··························································557

● Concentration ·······················································559

● Exhaust ······························································· 561

● Pressure ·······························································563

05. Cleaning의 미래기술 ····················································565

11 CMP 공정

01. CMP공정 소개·····························································573

02. CMP공정의 종류와 특징···············································578

● Planarization···········································
····················431
● 식각 가스와 식각 물질 ·············································440
03. Etch 적용과 응용·························································444
● Etch 대표 구조공정··················································444
● Etch 장비 구성과 종류··············································454
● Plasma Source에 따른 Etch 장비 구분························465
04. ETCH 실전, 양산 FAB에서 ETCH 엔지니어 업무··············· 476
● 팹에서의 양산 기술·················································· 476
● Etch 장비의 유지 관리··············································482
● 양산에서 Etch가 가지는 어려움··································487
● Etch 양산 엔지니어의 하루········································489
05. Etch Issue 및 향후 개발 방향········································ 490
● 반도체 미세화 트렌트와 식각 이슈······························490
● 기술적 한계 극복 방안과 기술 발전 방향······················492

10 Cleaning 공정
01. Cleaning공정······························································507
● Cleaning공정 소개···················································507
02. Cleaning Chemical의 종류와 특징 ································ 511
● SPM 세정······························································· 511
● APM 세정······························································· 514
● DHF / BOE 세정······················································ 517
● H3PO4, Phosphoric Acid 세정····································520
● Ozone 세정 ···························································521
● NFAM 세정····························································525
● Function Water 세정················································527
● HF/NH3 Gas 건식 세정·············································531
03. Cleaning 장비의 종류와 특징 ········································534
● Batch Type····························································534
● Wet Single Type·····················································537
● Dry Single Type······································
················539
● Scrubber 세정························································542
04. Cleaning공정의 품질 관리와 생산장비 관리····················544
● defect ··································································544
● Uniformity ····························································546
● Contamination ·······················································548
● Fume····································································548
● Cross contamination···············································550
● Selectivity······························································552
● Leaning·································································553
● Flow Rate······························································555
● Temperature··························································557
● Concentration ·······················································559
● Exhaust ······························································· 561
● Pressure ·······························································563
05. Cleaning의 미래기술 ····················································565

11 CMP 공정
01. CMP공정 소개·····························································573
02. CMP공정의 종류와 특징···············································578
● Planarization··························································578
● Isolation·································································580
03. CMP 장비의 구성과 특징··············································582
● Polisher·································································582
● Cleaner··································································584
● EPD······································································587
04. CMP공정의 품질 관리와 생산 장비 관리·························· 591
● Defect, Scratch·······················································591
● Uniformity, APC··························578

● Isolation·································································580

03. CMP 장비의 구성과 특징··············································582

● Polisher·································································582

● Cleaner··································································584

● EPD······································································587

04. CMP공정의 품질 관리와 생산 장비 관리·························· 591

● Defect, Scratch·······················································591

● Uniformity, APC······················································594

● Slurry ···································································596

● Selectivity······························································599

● Dishing, Erosion······················································600

● Pad ······································································602

● Disk ······································································604

● Membrane·····························································605

● Retainer Ring ·························································609

● Brush ··································································· 610

● Filter ·····································································611

05. CMP의 미래 기술 ························································ 613

12 MI (Metrology & Inspection)

01. Metrology ································································· 619

● Metrology 개론······················································· 619

● Device 박막 두께 측정·············································· 619

● Device 구조/형태 측정·············································624

● 박막 조성/물성 측정·················································629

● 휨 측정····················································
···········································594
● Slurry ···································································596
● Selectivity······························································599
● Dishing, Erosion······················································600
● Pad ······································································602
● Disk ······································································604
● Membrane·····························································605
● Retainer Ring ·························································609
● Brush ··································································· 610
● Filter ·····································································611
05. CMP의 미래 기술 ························································ 613

12 MI (Metrology & Inspection)
01. Metrology ································································· 619
● Metrology 개론······················································· 619
● Device 박막 두께 측정·············································· 619
● Device 구조/형태 측정·············································624
● 박막 조성/물성 측정·················································629
● 휨 측정··································································636
02. Inspection·································································637
● Inspection 개론·······················································637
● BF/DF 검사·····························································638
● 파티클 카운터························································· 641
● 매크로 검사····························································643
● 전자빔 검사····························································643
03. 공정 계측 응용기술······················································646
● 가상계측································································646
● 측정 검사 기술 동향과 미래····························636

02. Inspection·································································637

● Inspection 개론·······················································637

● BF/DF 검사·····························································638

● 파티클 카운터························································· 641

● 매크로 검사····························································643

● 전자빔 검사····························································643

03. 공정 계측 응용기술······················································646

● 가상계측································································646

● 측정 검사 기술 동향과 미래······································647

13 반도체 용어해설

반도체 용어해설·································································654
························647

13 반도체 용어해설
반도체 용어해설·································································654